First, the coordinate file
Tool - Report - place component Report - report - Save .xls
Second, the bit number map
Geometry:
Top
Assembly_top:
PCB Assembly: It is to assemble the components and so on to the printed circuit board, also called PCBA, the Chinese name is the circuit board/printed circuit board
Place_bould_top: component footprint and height
Soldmask_top
Outline
Silkscreen_top
Componet:
Assembly_top Ref.des
Third, BOM
Fourth, steel network data
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Edit——change——TEXT
Necessary CLASS and SUBCLASS in PCB Element (Symbo)
*These layers have been added when adding a pad, no additional need to add. Other layers need to be added when creating a package in Allegro.
** For PLACE_BOUND_TOP, the DIP component is 1mm larger than the part box and 0.2mm for SMD
Note: The layers may not be included in the layers except where indicated. In addition, other layers can be added as appropriate.
No. CLASS
SUBCLASS
Component Elements Remarks
1
ETH
Top
Pad/PIN (surface hole or through hole)
Shape (heat dissipation copper foil under the patch IC)
Necessary, conductive
2
ETH
Bottom
Pad/PIN (through hole or blind hole)
As required, conductive
3
Package Geometry
Pin_Number
The Pin number that maps the schematic components. If the PAD does not have a label, the labeling schematic does not care about the Pin or the mechanical hole.
4
Ref Des
Silkscreen_Top
The tag number of the component
5
Component Value
Silkscreen_Top
The model number or component value of the component
6
Package Geometry
Silkscreen_Top
Component shape and description: Lines, Arcs, Words, Shapes, etc. Required
7
Package Geometry
Place_Bound_Top
Component footprint and height necessary
8
Route Keepout
Top
Disallow wiring area as required
9
Via Keepout
Top
Prohibition of via areas as required
Remarks:
Regular pad,thermal relief,anTI pad concept and how to use it
A: Regular pad is mainly connected with all positive films such as top layer, bottom layer, and internal layer (including wiring and copper plating). Generally used in the top, bottom, and signal layers, because these layers are more positive.
Thermal relief (another wind pad), anTI pad (isolating pad), is mainly connected to the negative and isolation insulation. Generally used in the internal electrical layer such as VCC or GND, because these layers are more negative. However, we also set the thermal relief (hot air pad) and anTI pad parameters in the begin layer and the end layer. This is because the begin layer and the end layer may also be used as inner layer or negative layer.
In summary, that is, for a fixed pad connection, if your layer is positive, then connect to this pad via the regular pad you set, thermal relief, anTI pad ( The isolation plate) has no effect on this layer.
If this layer is negative, it is connected and isolated by thermal relief, anti pad, and the regular pad has no effect on this layer.
Of course, a pad can also be connected to the network with a positive pad of the regular pad and the top layer. At the same time, a thermal relief is used to connect the negative layer of the internal layer of the GND with the network.
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