[Sinsys announced that it is working with Toshiba to accelerate 3D Flash verification, aiming to double its circuit simulation speed] The world's largest chip automation design solution provider and the world's largest chip interface IP provider, information security and software Synopsys, Inc. (NASDAQ: SNPS), a global leader in quality, announced that it has partnered with Toshiba to accelerate the verification of ToshibaBiCSFLASHTM vertical stacked 3D (3D) Flash. Working closely with Toshiba, Synopsys has introduced innovative simulation algorithms for its FineSim® ProFastSPICE tool to address the increasing design complexity of 3D NANDFlash. These new technologies increase the simulation speed by an average of 2 times, reducing the simulation run time of several days to one day.
Compared to traditional Flash devices, 3DFlash devices have larger memory arrays, more complex analog and programming circuits, and a large power distribution network. In addition, due to the memory stacked array structure, the 3DFlash design must account for the enhanced coupling effects caused by the layout parasitic elements. With existing circuit simulation techniques, higher and higher complexity can result in simulation times that last for several days. Working closely with Toshiba, the latest version of FineSimProFastSPICE uses several key technologies optimized for 3DFlash simulation to efficiently handle massive array structures, large power distribution networks, more layout parasitic components, and high-precision analog circuits.
Shigeo (Jeff) Ohshima, Technical Director of ToshibaSSD Application Engineering, said: "FineSim has been our signoff circuit simulator since the beginning of 2000. The long-term cooperation with Synopsys allows us to lead the same technology for a wide range of applications. Flash products. By working closely with Synopsys, we deployed FineSimPro to validate our latest BiCSFlash and meet stringent quality and reliability requirements."
Paul Lo, vice president of engineering at Synopsys Design Group, said: "Advanced Flash design requires a lot of circuit simulation to ensure design stability, reliability and cost competitiveness. Our team will continue to work closely with Toshiba to provide new Circuit simulation technology to meet the stringent requirements of simulating complex 3D NANDFlash to create a super chip."
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