With the rapid development of science and technology, the market demand is changing and the competition of commodities is becoming more and more fierce, the cycle of product renewal is becoming shorter and shorter, and the proportion of multi-variety and small-batch production is getting higher and higher. In order to adapt to this change in the situation, various package testing and burning fixtures are required to cope with mass production.
Why do you need so many test and burning fixtures?
Subjective reasons: products with different functions require chips with different functions to realize product functions;
Objective reason: the original semiconductor manufacturer manages different functions of the chip through different packages to achieve product differentiation management;
Our common packages have the following:
There are feet on both sides (SOP)
Four-legged (QFP)
There are four feet without feet (QFN)
There are no feet, but there are balls (BGA)
As can be seen from the above picture, the same function chip often has several specifications and sizes, which can also be called package.
There are many kinds of chip sizes (packages), but in the case of a burner, the various packages can be integrated into a burner through the conversion of the fixture, which is convenient for factory production. For example, SmartPRO T9000-PLUS is the same. In the form of:
How to make the right choice?
First of all: you need to know the "three measurements" of the object to be burned, size, foot spacing, thickness;
Second: carry out tolerance testing;
Finally: choose the form of contact
Specific to a product can be like this:
It can also be like this:
The programming interface provided by the programmer is used to match the chips of various packages. It is recommended that the mass production customers select the adapter recommended by the manufacturer of the burner for chip burning. If the untested adapter is used, there will be poor contact. , card bad chips and other things to reduce the success rate of burning.
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