1. TSMC 7nm process and then win the Broadcom AI chip big single;
Broadcom has launched a silicon-proven 7-nanometer IP core that will target the popular artificial intelligence (AI), 5G and high-bandwidth networks with special application chips (ASICs). The 7-nanometer ASIC built by Broadcom for customers was finalized at the end of last year. Broadcom also indicated that it will hand over the 7-nanometer ASIC foundry and CoWoS packaging orders to TSMC.
TSMC's 7nm process leads the industry. Following the industry's emergence of Apple's next-generation A12 application processor, AMD's next-generation Vega graphics chip, and Qualcomm's next-generation Snapdragon mobile phone chip, all will use TSMC's 7nm process, and Broadcom will also use TSMC. The nano-process creates an ASIC platform and grabs markets such as AI and high-speed networks with strong demand.
Broadcom builds an ASIC platform based on TSMC's 7nm process and announces the industry's introduction of 7nm process silicon certified IP cores, including high-speed serial serial deserializers (SerDes), second and third generation high-bandwidth memory physical layers (HBM Gen2) /Gen3 PHY), chip stack physical layer (Die2Die PHY), mixed signal and basic silicon intellectual property. As for the ASIC platform processor core, the ARM core and peripheral IP core are used.
In addition to locking in AI applications such as deep learning and rushing into the high-performance computing (HPC) chip market, Broadcom's 7-nm ASIC will also integrate memory such as HBM Gen2/Gen3 directly into the chip using TSMC's CoWoS advanced packaging technology. As for the high-speed SerDes IP core, it will help to build high-speed switch or router application chips, as well as complete system single chips supporting 5G high-speed and broadband networks. Broadcom said that the 7-nanometer ASIC for its major pre-customers was finalized at the end of last year.
For TSMC, 7nm is the highlight of this year's operation. It is expected that after the completion of the relevant capacity production this year, the volume of the film will increase rapidly after the second quarter. Wei Zhejia, CEO of TSMC, pointed out in a legal briefing last week that TSMC has 10 chips in 7 nanometers to complete the design finalization, and will enter the mass production phase after the second season, while the first quarter is expected to have another 10 7 nanometer chips. The design finalization will be completed. At the end of this year, the number of 7-nanometer chips will be more than 50. The main applications include mobile devices, games, central processing units, programmable logic gate arrays (FPGAs), Netcom and AI.
TSMC expects revenue in US dollars in the first half of this year to grow slightly above 15% compared to the same period last year. In the second half of the year, revenue will be slightly lower than 10%. The industry said that the first quarter of TSMC's estimated revenue will be between 8.7 billion and 8.5 billion US dollars, the second quarter revenue performance will be slightly lower than the first quarter of 83 to 8.4 billion US dollars, and the third quarter began to recognize After the 7nm revenue, revenue is expected to jump to more than 9 billion US dollars, does not rule out the possibility of a single quarter revenue of 10 billion US dollars in the fourth quarter.
2. After iPhone X, what are the big winners of 3D sensing? ;
3D Sensing After the launch of the new machine in the Apple camp, the craze gradually boiled to the highest point. After the popular iPhone X debut, 3D sensing is the hottest topic in the near future. This time, iPhone X canceled the Home button and switched to it. Face ID unlocking instead of fingerprint recognition, 3D sensing has become the biggest contributor, setting an innovative standard in the trend of smart phones.
The possibility of using it on smartphones is increasing
3D sensing applications are widely used, especially after the iPhone X is leading the trend, other mobile phone manufacturers are bound to follow up. It is reported that the high-end models that will be released by the Android camp in 2018 will be equipped with related functions to improve the unit price.墣 , iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone iPhone 209%. In addition to mobile phone 3D sensing, the future can be extended to notebooks, personal computers, sweeping robots, etc. Even the next main battlefield is likely to be a new field such as AR/VR, drones and self-driving cars, so it is more futuristic. The theme has also begun to brew and fertilize. Simply put, the 3D sensing market looks bright! Many related supply chain manufacturers will also have the opportunity to eat this pie in the future.
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In fact, the past sensing technology used in Microsoft Xbox's Kinect game console. With the increasing demand for AR/VR in recent years, Apple aims to acquire 3D sensing technology manufacturer's PrimeSense in 2013, making 3D sensing. The possibility that technology futures will be used in smart phones is increasing. It is worth mentioning that in the past, only 2D technology was used in smartphones. Even the Galaxy S8 smart phone launched by Samsung Electronics in 2017 did not have the function of built-in 3D sensing technology. In addition to the Taiwanese electronics company's packaging factory to pick up the black horse, the deep, VCNET's stable, new and Hongjieke is also extremely explosive.
Dark horse fine stock price hurricane
Apple's new mobile phone iPhone X's biggest highlight is the 3D sensing. After the launch, there was a rush in the market, and the trend was suddenly formed. The related Taiwanese factories also welcomed the unexpected peak period in the off-season. It is reported that 3D sensing related component suppliers, Divided into two camps of Apple and Qualcomm, and cut into two parts: the transmitting end and the receiving end. The Apple camp uses TSMC to provide the DAE of the transmitting end of the optical module, while the fine material and the picking process provide the back-end process. Amnesty Apple's beneficiary factory, the most special one is the VESCEL lens packaging test, not only from July 2017, revenue continued to hit a new high in the year, the third quarter revenue reached 993 million, EPS rebounded from a negative 1.33 yuan in the second quarter to a negative 0.74 yuan. Although the third quarter was at a loss, the legal person expected a rapid improvement in the utilization rate in the fourth quarter, and did not rule out the loss of profits or benefits. imagination. In addition, the legal person expects that there will be a post-3D sensing application in 2018, the 3D sensing function will be moved to the back panel, the integration of the complete rear lens 3D sensing application, plus the original face recognition of the front lens, this The latest process is expected to be released in volume in 2018. According to the legal person, the next generation of Apple's new machine is already setting specifications. It is very likely that the refined material will seize the opportunity and lead the pack. Especially in the Taiwan stock market volatility, the stock price of the rich material with rich dad support is the historical high since the listing. It has soared to around 100 yuan, or there is a new mainstream that suggests that the finale is quietly appearing, but the cumulative increase in the short-term has been large. Since December 2017, the stock price has started to show obvious corrections. Profits have been sold out of the market. Before the next market, there may be a need for chip change and precipitation. You may wish to wait patiently. Financial newsletter
3. The main challenges facing China's 5G chips;
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