iPhone X near-infrared 3D camera module dismantling large exposure

STMicroelectronics' Near Infrared Camera Sensor in the Apple iPhone X

——Reverse analysis report

The first near-infrared camera image sensor based on Imager-SOI substrate produced by STMicroelectronics, applied to Apple iPhone X original deep camera (TrueDepth)

Apple iPhone X near-infrared 3D camera disassembly and image sensor reverse analysis Before all smartphone competitors, Apple opened a 3D sensing face recognition application tour (Note: Lenovo's integrated Google Tango camera was mainly The application is environment aware). To commemorate the 10th anniversary of the iPhone, the new iPhone X integrates the "TrueDepth" camera - a near-infrared 3D camera. STMicroelectronics offers the camera a 3D time-of-flight (ToF) near-infrared image sensor for applications such as face recognition and mobile payment. The near-infrared camera's image sensor works with a dot matrix projector to achieve high-precision depth sensing. The image sensor uses Soitec's Imager-SOI technology for higher quantum efficiency and extremely low noise.

Near-infrared image sensor with SOI substrate Note: According to previous reports by Memes Consulting, Soitec, a leader in semiconductor materials design and manufacturing in the electronics industry, has launched a breakthrough next-generation SOI (silicon-on-insulator). The substrate, the latest generation of its Imager-SOI product line, is designed for front-end near-infrared image sensing applications such as advanced 3D image sensors. Soitec is now able to offer this mature SOI wafer on a large scale to meet customers' growing 3D in AR/VR (augmented reality/virtual reality), face recognition security systems, advanced human-computer interaction and other emerging applications. Sensing and imaging needs.

Apple iPhone X dismantling When we disassembled and analyzed Apple's near-infrared 3D camera (TrueDepth), we discovered a number of innovative technologies that integrate a "complex combination of five sub-modules": NIR camera, ToF measurement Distance sensor + infrared flood illuminator, RGB camera, dot matrix projector and color / ambient light sensor. The 3D camera module uses a stud bump to connect a near infrared image sensor (flip chip) and an optical module including four lenses.

Apple iPhoneX 3D camera (TrueDepth) disassembly analysis

Apple iPhone X near infrared 3D camera module appearance

Apple iPhone X near-infrared 3D camera module Phone X near-infrared 3D camera module analysis of SOI substrate improves quantum efficiency and reduces noise from the substrate. Combining ST's near-infrared sensing technology with new technology nodes (SOI processes below 140 nm), this near-infrared image sensor chip has very small pixels and high resolution (nearly two megapixels). Therefore, the sensor can accurately detect a face and unlock the smartphone in a short response time. Deep trench isolation (DTI) technology used in conjunction with SOI substrates provides image sensors with a high dynamic range of pixels.

Near-infrared image sensor in Apple iPhone X 3D camera (TrueDepth)

Image sensor chip for Apple iPhone X near-infrared 3D camera This report provides a complete analysis of the Apple iPhone X near-infrared 3D camera sensor, including both module and sensor chip, and estimates its cost and price. In addition, this report compares it with other near-infrared image sensors, such as Infineon, pmd and Tower Semiconductor in consumer electronics, Melexis in automotive electronics, and Texas Instruments in the industrial sector. (Texas Instruments).