Japan's IDEC Corporation (IDEC Co., Ltd.) has developed a new manufacturing process that can achieve stable quality and simplify processes, and can greatly improve the efficiency of work in LED packaging.
In the case of a blue LED module with a yellow phosphor-based pseudo white LED module, the new manufacturing process only needs to cover the phosphor-containing gel-like silicone resin sheet on the LED assembly to heat the LED assembly, and then package the LED assembly. The time required for the packaging process can be shortened to 1/9 compared to the manufacturing method in which the liquid resin is poured.
The new manufacturing method is to cover the gel-like resin sheet on the LED module, heat it to about 150 ° C, and after 40 minutes, the sheet is hardened, thereby completing the packaging. In the past, it took 6 hours to complete the entire packaging process (from dam formation to thermal hardening) by encapsulating the liquid resin. In the new manufacturing method, since the sheet is gel-like, the phosphor does not precipitate, and the unevenness in quality resulting in the encapsulation process is greatly reduced. And production equipment is expected to be greatly simplified.
It is understood that Adek has concentrated the production of white LED modules for lighting in the Hamamatsu factory and plans to replace all modules with new manufacturing methods in 2013.
In the case of a blue LED module with a yellow phosphor-based pseudo white LED module, the new manufacturing process only needs to cover the phosphor-containing gel-like silicone resin sheet on the LED assembly to heat the LED assembly, and then package the LED assembly. The time required for the packaging process can be shortened to 1/9 compared to the manufacturing method in which the liquid resin is poured.
The new manufacturing method is to cover the gel-like resin sheet on the LED module, heat it to about 150 ° C, and after 40 minutes, the sheet is hardened, thereby completing the packaging. In the past, it took 6 hours to complete the entire packaging process (from dam formation to thermal hardening) by encapsulating the liquid resin. In the new manufacturing method, since the sheet is gel-like, the phosphor does not precipitate, and the unevenness in quality resulting in the encapsulation process is greatly reduced. And production equipment is expected to be greatly simplified.
It is understood that Adek has concentrated the production of white LED modules for lighting in the Hamamatsu factory and plans to replace all modules with new manufacturing methods in 2013.
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