[Text / high-tech LED Xu Chaopeng] On the afternoon of December 11, 2015, the high-tech LED annual meeting "Where is LED lighting going, the game in the next three years" will be launched as scheduled in Shenzhen Convention and Exhibition Center, Dr. Xiao Guowei, President of Jingke Electronics, will make "APT CSP technology application" And the theme of evolutionary trends.
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“CSP is currently suitable for the backlight and general lighting market due to its small size, large illumination angle, high current drive, excellent heat dissipation and high reliability. At the same time, CSP has begun to emerge in the BLU backlight market throughout 2015. With its supporting lens resources approaching maturity, CSP is expected to be the perfect solution for direct-lit backlights." Xiao Guowei mentioned.
Among them, Jingke Electronics' APT CSP technology adopts mature flip chip and packaging technology platform, which can perfectly solve the phenomenon that the chip and substrate CTE are not matched, and adopts accurate and mature phosphor coating technology to ensure light color. Consistency, according to different optical design needs, can provide a variety of CSP products.
"The market share of flip-chip LED chips will expand in the future, and will be close to 30% in 2016. Flip-chip technology combined with packaging technology can perfectly realize the vertical integration of upstream and downstream technologies, shorten the industrial chain, reduce costs, and realize chip-scale packaging (CSP). ) The mainstream technology route." Xiao Guowei said.
According to Xiao Guowei, the entire CSP light source technology has become more mature in 2015, and international and domestic manufacturers have successively exerted their efforts, which also provides technical guarantee for large-scale application of CSP.
"Compared with the traditional PPA/PCT/EMC bracket type SMD products, CSP products have good heat dissipation effect, can achieve ultra-high current drive, ensure long-term work reliability, and have a large single light output, which is suitable for direct-type backlights to reduce lamp beads. The quantity and cost reduction requirements are also easier to achieve uniform light distribution at large pitches of the lamp beads, meeting the requirements for reducing the number of lamp beads." Xiao Guowei mentioned.
"In the future, with the maturity of 8-inch silicon wafer technology, the cost of CSP light source will drop rapidly, and it is expected to be applied to the general lighting market in batches in 2016." Xiao Guowei concluded.
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